With the ENDORFY Signum M30 series, ENDORFY is entering the micro ATX case segment for the first time – and making a strong statement straight away. Inspired by the popular Signum 300 series, the new mini tower generation is aimed at all those who want to accommodate powerful hardware in a compact form factor. Two variants – Signum M30 Air and Signum M30 ARGB – combine a sophisticated cooling concept, modern connections and flexible configuration options.
- Supports GPUs up to 345 mm and radiators up to 240 mm
- Mesh front with dust filter and perforated top for optimized airflow
- Up to seven 120 mm fans possible, three PWM fans pre-installed
- USB-C 3.2 Gen 2×2 with up to 20 Gb/s directly in the front I/O
ENDORFY Signum M30: Compact construction meets sophisticated airflow design
The ENDORFY Signum M30 series was specially developed for compact but powerful systems. Despite its mini-tower format, the case offers sufficient space for high-end components. There is space for graphics cards up to 345 mm long, power supply units up to 180 mm or CPU air coolers with a height of 159 mm. 240 mm radiators can also be integrated – a clear advantage for powerful gaming PCs or workstations with AIO water cooling.
A central element is the optimized airflow design. The mesh front also acts as a dust filter and enables virtually unhindered airflow. The concept is complemented by a perforated top side that efficiently directs warm air to the outside. This setup contributes significantly to thermal stability and supports constant performance even under load.
Both variants are factory-fitted with three Stratus 120 PWM fans, which were developed in collaboration with Synergy Cooling. The PWM control allows precise speed control – including a quiet fan stop mode at low load. All fans are connected via a pre-installed PWM splitter, allowing the entire cooling system to be conveniently controlled via a single motherboard header. A total of up to seven 120 mm fans can be installed, allowing maximum flexibility in the cooling configuration.
Flexible equipment and modern connectivity in Micro-ATX format
In addition to the cooling concept, the ENDORFY Signum M30 series impresses with its clever interior layout. The two-chamber design separates the power supply and drives from the main area, which improves both air circulation and cable management. Dedicated cut-outs and mounting points are provided behind the motherboard tray for neat cable routing. A side panel made of tempered glass provides a clear view of the installed hardware and underlines the modern character of the case.
The ARGB version also offers fully customizable lighting. Effects and colors can be controlled directly on the housing using a controller supplied. Alternatively, synchronization with compatible mainboards is possible via the corresponding ARGB header. This makes the Signum M30 ARGB ideal for visually coordinated setups.
The housing is also future-proof when it comes to connections. The top I/O panel integrates two USB-A 3.2 Gen 1 ports (up to 5 Gb/s), separate 3.5 mm audio connections and a USB-C 3.2 Gen 2×2 connection with transfer rates of up to 20 Gb/s. This port is a clear added value in the micro ATX segment, especially for fast external SSDs or modern peripherals.
Micro-ATX, Mini-ITX and FlexATX mainboards are supported. Two 2.5-inch and two 3.5-inch drive bays are also available – sufficient for gaming and production systems alike.
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Conclusion
The ENDORFY Signum M30 series proves that compact Micro-ATX cases do not have to compromise on features and cooling performance. With a strong airflow design, modern connectivity including USB-C 20 Gb/s and generous hardware support, the series positions itself as an attractive basis for high-performance systems.
The Signum M30 Air is available from €65 RRP, the Signum M30 ARGB from €72 RRP – both models are available now.
